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iXsenic: a viable alternative
Evonik Industries AG Essen, Germany
Evonik has long been focusing on solution-based inorganic materials for the processing of semiconductor, dielectric and passivation layers in TFT backplanes. ...
Fused Silica Wafers
Edmund Optics Inc. (EO) Barrington, United States
UV Fused Silica Substrate Ultrasonically Cleaned Less than 10Å Surface Roughness Fused Silica Wafers are thin, circular pieces of UV fused silica ...
Jiangxi LDK Solar Hi-Tech Co., Ltd. Xinyu, China
Production Technologies We use metallurgical silicon as a raw material to produce TCS, which is then used to produce polysilicon. This technology enables ...

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Semiconductor Material News
Evonik and Holst Centre enter next phase of joint partnership introducing iXsenic technology into mass production 9/30/2014
Quadrant Introduces Breakthrough Engineering Plastic Material at SEMICON West 2012 7/26/2012
CICC talk: Graphene could succeed CMOS 9/21/2011
SGL Group: Utz-Hellmuth Felcht Award First winner honored at the International Carbon Conference in Shanghai 7/29/2011
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Semiconductor Material Exhibitions
Material+ KOREA 2018
7/11/2018 - 7/13/2018
Seoul, South Korea
SEDEX 2018
10/17/2018 - 10/19/2018
Seoul, South Korea
IC China 2018
10/31/2018 - 11/2/2018
Shanghai, China
IWN 2018
11/11/2018 - 11/16/2018
Kanazawa, Japan
CSTIC 2019
3/11/2019 - 3/12/2019
Shanghai, China
Material+ KOREA 2019
7/11/2019 - 7/13/2019
Seoul, South Korea
SEDEX 2019
10/17/2019 - 10/19/2019
Seoul, South Korea
IC China 2019
10/31/2019 - 11/2/2019
Shanghai, China
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