|
|
Apolhya TPE - Nanostructured and temperature resistant
|
|
Apolhya® as a TPE material : synergistic performances
- Flexibility of functional polyolefins
- High thermomechanical resistance of polyAmides
- Good chemical resistance (water, oil, salt, glycol)
- Low density (< 1)
- Creep and heat ageing resistant up to 180ºC
- Ductile /brittle transition Tº - 60ºC to -20ºC depending on grade
- Melting point adjustable from 130 to 220ºC
- Flex modulus from 35 to 500 MPa, 80 to 90 shore D
- Large range of viscosities : MFI (230ºC, 2.16 Kg) = 1 to 40 g/10 min
Apolhya® as an additive
- Impact modifier (e.g. nylon matrix)
- Adhesion promoter of TPV to polyamides
- Creep resistance improver for polyolefins (+10 - +20ºC)
Applications
Due to the excellent physical and chemical properties, this new product can be used in a wide range of applications requiring high flexibility, as well as heat, oil and hydrolysis resistance (e.g. cables). |
|
Related Products |
| PEEK/PEK Guangzhou Jingchang Engineering Materials Co., Ltd Heat resistance :continuous operating temperature is 260 ,if reinforced with glass fiber or carbon fiber ,it can be reaching over 300
Mechanical performance ... | | PTFE Product Guangzhou Jingchang Engineering Materials Co., Ltd 1. Excellent resistance to chemicals.
2. Large temperature range from -200oC up to +250.
3. Anti-adhesive surface and low friction.
4. Pure PTFE ... | | POM Product Guangzhou Jingchang Engineering Materials Co., Ltd 1.Fatigue resistance and high strength.
2.Excellent abradability.
3.Low water absorption.
4.Hard surface with good rigidity.
5.Stable size, with ... | | PPS Product Guangzhou Jingchang Engineering Materials Co., Ltd 1.Excellent chemical resistance.
2.Low creep property.
3.Low water absorption.
4.Excellent stable size.
5.High elastic and excellent molding. ... | | PEEK Product Guangzhou Jingchang Engineering Materials Co., Ltd 1.Low creep property.
2.High elastic and excellent molding.
3.Excellent abradability and low friction.
4.Resistant to corrosion of various mediums. ... |
|
|
|
|