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Japan Institute of Electronics packaging (JIEP)
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The Japan Institute of Electronics packaging (JIEP) was established in 1998 by the merger of the former ¡ºSociety for Hybrid Microelectronics¡± and the former ¡ºJapan Institute for Printed Circuit,¡± and is one of the largest academic societies for electronics packaging technology in Japan. Some 2,400 researchers and engineers, active in the front lines of industry and academia, form a community concerned with packaging technology, one of the core technologies of Japan's electronics industry, and contribute to the advancement of research and development and the training of engineers.
Upcoming Events:
ICEP 2027
International Conference on Electronic Packaging
4/15/2027 - 4/19/2027
Website: https://www.jiep.or.jp/
Telephone:+81-03-5310-2010
Address:3-12-2 Nishiogikita, Suginami-ku, Tokyo 167-0042, Tokyo, Japan
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